DenseLight at a Glance

Julian has over 30 years working experience in investment banking and telecommunications media industry. From 2001 to 2005, he was the Vice President of Finance of Taiwan Telecom Group, Chief Financial Officer of Chia Tai (Indonesia ) Telecom. Prior to that from 1987 to 2000, Chemical Bank, Bankers Trust, New York and AIG Financial Products, Hong Kong.

He has a Master’s degree in Business Administration and Computer Information Systems from Dartmouth College; and a Bachelor’s Degree in Geology from National Taiwan University.

Dr. Lam received his B.Eng in Electrical and Electronic Engineering (First Class Honors) and his MSc in Industrial Engineering from the National University of Singapore., and his MSE and Ph. D. in Electrical Engineering from the University of Michigan, USA.

In 1985, he began his career with the Singapore unit of a UK-based multinational company in developing building automation products and subsequently establishing its manufacturing operations. From year 1990 to 2000, he was a professor in the School of Electrical and Electronics Engineering of the Nanyang Technological University of Singapore. Notable appointments in the University included Head of Microelectronics Division, Principal Staff Officer to the University’s President, and member of the NTU Council (University’s Board of Governors).

In Year 2000, he led the founding of DenseLight Semiconductors and raised a US$31.2 million VC Round from 3i-PLC (to establish a InP Optoelectronics Wafer Fab), and subsequently in 2003-2004 (despite negative market sentiment post 2002 photonics-crash) he raised US$8.6M to realize self-sustaining business operations by 2005 with revenue from products and services for its photonics sensing and test customers. He continued to serve as DenseLight CTO after the company was acquired by POET Technologies in May 2016.

Dr. Lam’s area of technical expertise is in optoelectronics, fiber-optics sensors, and photonics systems applications, and has contributed to some 300 publications and 60 patents. For the past 25 years, he has been a significant participant in a number of key initiatives to promote the growth of photonics-related research and industrial development in Singapore; and he is still doing so today.

Norman has over 25 years of banking and manufacturing experience. He was auditor of Hsinchu International Commercial Bank , Coretronic photoelectric, PEWC lithium battery, Chief Financial Officer of iST semiconductor (Great China).

He graduated with a Bachelor of Accounting, Taiwan Fujen University.

Bryan has more than 30 years’ experience in the manufacturing industry. He held numerous executive positions in companies spanning from semiconductor, sensing, and photonics industry, with a strong emphasis on Thermal Detection, MEMS, and Photonics. He holds 3 patents in the field of MEMS and facilitated packaging design for zero gradient package design for thermopile sensors. Many years of experience in Sales & Marketing of Photonics products.

He graduated with a Bachelor of Science in Packaging Engineering from Michigan State University.

Lay Cheng has over 25 years experience in Semiconductor and Photonics Industry; from wafer fabrication, product testing, opto-mechanical design to sub-system design and implementation.

She is a founding member of DenseLight in 2000 {Setup Wafer fab and developed key InP semiconductor photonics process blocks). Developed DenseLight photonic product architecture and photonics device fabrication design rules. Built DenseLight’s first photonic laser devices for the GPON project and successfully released in Year 2005. Core project member that delivered various multi-million-dollar-valued industrial photonics sensor projects prior to 2015, including two DARPA-funded projects for multispectral imaging and phase-array switches. She is managing Product Engineering Department and responsible for DenseLight’s GA and NPI product line management since 2016.

Lay Cheng holds a Masters Degree in Engineering from Nanyang Technological University.

Over 10 years of experience working in the semiconductor industry, specializing in epitaxy growth of III-As/P and III-N compound semiconductor materials using MOCVD. An expert in wafer bonding, facilitating the seamless integration of diverse materials on a common substrate.

Worked previously in Singapore-MIT Alliance for Research & Technology (SMART) and Advanced Micro-Fabrication Equipment Inc. China (AMEC).

Holds 12 patents and published more than 80 international journals.

B. Eng. (First Class Honours) and Ph.D. in Materials Science and Engineering from NTU. MBA from NTU.